11 Sep
|
Global Talent Alliance, Canada
|
Ottawa
11 Sep
Global Talent Alliance, Canada
Ottawa
Global Talent Alliance seeks a Microelectronic Packaging Design Engineer to join our Design Engineering team in Ottawa. You will lead the design of microelectronic modules and packaging concepts from concept through volume manufacturing, collaborating with electrical, RF, optical and mechanical engineers.
The role requires a solid background in wafer-level and chip-scale packaging, robust CAD skills (AutoCAD, SolidWorks) and experience with Cadence Allegro, plus familiarity with FEA tools for
📌 Senior Microelectronic Packaging Engineer RF/Optical Modules (Ottawa)
🏢 Global Talent Alliance, Canada
📍 Ottawa