Shape the future of optical technology with Ranovus as a Principal Advanced Optical Packaging Engineer in Ottawa, Ontario. This full-time role focuses on innovative packaging technologies for AI-driven optical engines.As a key player at Ranovus, you will drive the development of packaging and assembly strategies for advanced optical devices. You'll engage with cross-disciplinary teams, focusing on flip-chip assembly, laser integration, and fiber attachment. Your expertise in optical, mechanical, and thermal aspects will be essential as you manage processes from development through production.Key Responsibilities:Develop packaging architecture and assembly strategiesLead flip-chip and die attachment process developmentOversee laser packaging and hybrid integration processesDefine fiber attach and optical I/O strategiesManage NPI and manufacturing transfer processesRequirements:10+ years in photonic or optoelectronic packagingHands-on experience with flip-chip bonding and assemblyStrong understanding of optical and mechanical interactionsKnowledge of soldering and encapsulation processesEffective communication and technical judgment skillsBe part of transforming optical technologies in a collaborative setting at Ranovus.

📌 Principal Optical Packaging Engineer Ottawa (Riviere-des-Prairies—Pointe-aux-Trembles)
🏢 RANOVUS
📍 Riviere-des-Prairies—Pointe-aux-Trembles