Shape the future of optical technology with Ranovus as a Principal Advanced Optical Packaging Engineer in Ottawa, Ontario. This full-time role focuses on innovative packaging technologies for AI-driven optical engines.

As a key player at Ranovus, you will drive the development of packaging and assembly strategies for advanced optical devices. You'll engage with cross-disciplinary teams, focusing on flip-chip assembly, laser integration, and fiber attachment. Your expertise in optical, mechanical, and thermal aspects will be essential as you manage processes from development through production.

Key Responsibilities:



• Develop packaging architecture and assembly strategies • Lead flip-chip and die attachment process development • Oversee laser packaging and hybrid integration processes • Define fiber attach and optical I/O strategies • Manage NPI and manufacturing transfer processes

Requirements: • 10+ years in photonic or optoelectronic packaging • Hands-on experience with flip-chip bonding and assembly • Strong understanding of optical and mechanical interactions • Knowledge of soldering and encapsulation processes • Effective communication and technical judgment skills

Be part of transforming optical technologies in a cooperative environment at Ranovus. #J-18808-Ljbffr

📌 Principal Optical Packaging Engineer Ottawa (Montreal)
🏢 RANOVUS
📍 Montreal