Principal Advanced Optical Packaging Engineer
Location: Ottawa, Ontario | Type: Full-timeThe Prospect

Ranovus is seeking a Principal Advanced Optical Packaging Engineer to develop and industrialize packaging technologies for next-generation optical engines used in AI and data-center connectivity. This hands-on role covers package/process architecture, flip-chip and BGA assembly, hybrid laser integration, fiber attach, optical alignment, thermal-mechanical risk management, burn-in, tooling, automation, and manufacturing transfer. Working directly with design teams, equipment developers, suppliers, CMs, and OSAT partners.

What You Will Own

- Package & Process Architecture: Translate product requirements into packaging/assembly strategies;
define build sequences,inspection points, rework, and test gates;
lead DFM/DFA/DFT/DFR reviews;
identify risks and drive DOEs/qualification.
- Flip-Chip, Die Attach & Electrical Integration: Develop/qualify flip-chip and fine-pitch die-attach processes (copper-pillar, BGA, LGA, WLCSP);
define reflow, solder paste, flux, and cleaning approaches;
manage warpage, CTE mismatch, and voiding;
develop underfill/encapsulation processes;
define AOI, X-ray, and cross-section inspection methods.
- Laser Packaging & Hybrid Integration: Lead hybrid laser-to-carrier and laser-to-ePIC assembly process development;
work with laser die, lenses, isolators, and couplers;
define alignment, attachment, and burn-in/test flows;
manage supplier specs for laser components.
- Fiber Attach & Optical I/O: Develop repeatable fiber-array attach processes (single-mode, PM fiber, multi-fiber arrays);
define alignment strategy, adhesive/cure processes, and loss-control methods;




support automated fiber-attach station development (motion, vision, dispensation, calibration).
- Thermal-Mechanical & Materials: Evaluate thermal paths and manage package stress/warpage/CTE mismatch;
select and qualify solders, underfills, adhesives, TIMs, and encapsulants;
partner with mechanical/simulation specialists.
- NPI & Manufacturing Transfer: Lead processes from POC through NPI, qualification, and production ramp;
define tooling, SOPs, PFMEAs, and control plans;
drive root-cause/corrective action;
decide what stays in-house vs. transfers to partners

Required Experience
- 10+ years in advanced optical packaging, photonic packaging, optoelectronic assembly, semiconductor packaging, or precision micro-assembly.
- Demonstrated ownership of packaging processes from development through NPI/production transfer.
- Hands-on experience in several flip-chip bonding, fine-pitch die attach, copper-pillar/solder-bump interconnect, BGA/LGA assembly, substrate/interposer integration, laser die/subassembly packaging, fiber-array attach, active/passive optical alignment, underfill/encapsulation/adhesive processes.
- Strong grasp of how optical, mechanical, thermal, electrical, material, and manufacturing requirements interact in an optoelectronic package.
- Practical knowledge of soldering, wetting, flux,



intermetallics, surface finishes, underfill, adhesives, curing, and contamination control.
- Experience with DOEs, process characterization, qualification builds, and failure analysis.
- Experience defining process windows, inspection criteria, and manufacturing controls.
- Ability to distinguish lab demonstrations from robust, transferable manufacturing processes.
- Experience with external manufacturing partners, equipment suppliers, or component vendors.
- Strong technical judgment and communication skills.

Particularly Valuable Experience
- Laser/laser-array/hybrid laser-photonic subassembly packaging;
co-packaged or externallaser sources.
- Single-mode edge coupling, lensed coupling, mode-field conversion, isolators, turning optics.
- Laser characterization, chip-on-carrier test, burn-in, reliability qualification.
- Silicon photonics packaging for transceivers/optical engines (800G-6.4T+).
- Automated optical alignment equipment (e.G., FiconTEC);
motion control, machinevision, force sensing, UV curing.
- Organic substrates, advanced interposers, high-density BGA connectors.
- Thermal-mechanical modeling (warpage, stress, CTE, solder-joint reliability).
- SPC, MSA, GR&R;, Cp/Cpk, yield improvement.
- CAD experience (SolidWorks or comparable).

Education

Bachelor's in Mechanical, Materials, Electrical Engineering, Physics, Optics, Photonics, Packaging Engineering, or related field required;
Master's/PhD preferred.Deep relevant experience may substitute for an advanced degree.

The Successful Candidate

Someone who has personally built and debugged complex optoelectronic hardware who

📌 Principal Advanced Optical Packaging Engineer (Canada)
🏢 RANOVUS
📍 Canada