About Inpho Inpho is a fast-growing scale-up, focused on developing cutting-edge optoelectronic solutions for next-generation communications, and photonic systems. Our multidisciplinary team is pushing the boundaries of innovation in integrated photonics and semiconductor packaging. Inpho’s new class of electro-photonic chips is poised to revolutionize and disrupt the optical interconnect market. new architectures to bedeployed that provide significantly higher price/performance;

About the Role
We are seeking a Senior/Principal Custom IC Layout Engineer who will contribute to Inpho’s innovative products, designing and implementing industry leading laser/EAM drivers and TIAs in both SiGe and InP. This includes fully integrated electronic-photonic ICs that are unique in the industry. Apply advanced layout techniques including common-centroid structures, interdigitation, symmetry, dummy devices, guard rings, substrate isolation, and sensitive-node shielding. Work closely with circuit designers to understand circuit intent and optimize layout for performance, area, noise, matching, and reliability. Support parasitic extraction and post-layout simulation and help resolve layout-dependent performance issues. Coordinate with circuit design, verification, CAD, process, and foundry teams as required. Identify opportunities to improve layout quality, productivity, automation, and design methodology. Mentor other engineers and contribute to the technical growth of the layout team. Bachelor's degree in Electrical or Computer Engineering preferred; Demonstrated top-level floorplanning experience,



from architectural block placement through final signoff, on multi-block or multi-die designs ~ Proven layout experience on high-speed circuits: differential/matched pairs, transmission-line structures, EM-aware routing, and isolation/shielding for high-frequency blocks. ~ Experience leading layout efforts across multiple, geographically distributed design teams/sites. ~ Direct, working-level experience interfacing with foundry and assembly/packaging houses (design kit qualification, DRC/LVS/PDK sign-off, package co-design, bond-pad/RDL considerations). ~ Robust communication skills and the ability to work independently and as part of a fast-paced engineering team. Prior exposure to III-V compound semiconductor processes (InP, GaAs) is a strong plus and accelerates ramp into InP HBT layout. Comfortable serving as the layout point-of-contact across cross-functional design, foundry, and packaging teams. Competitive salary, full health benefits and equity packages, flexible work environment, and career growth opportunities. Come work with a dynamic, high-talent team to build and commercialize the highest-performance photonics chips in the world The expected compensation range for this position is CAD$140,000
- $190,000 annually. Inpho may use Artificial Intelligence (AI) to support aspects of the recruitment process, including candidate screening and assessment. We provide equal employment opportunities without discrimination based on race, colour, religion, sex, gender identity or expression, sexual orientation, national origin, age, disability, veteran status, or any other characteristic protected by applicable law.

📌 Senior/Principal Custom Ic Layout Engineer (Canada)
🏢 Inpho
📍 Canada