Explore hardware engineering through Qualcomm’s 2027 intern class in Markham, building Snapdragon® mobile and Data Center SoCs with digital design skills. This interim engineering intern opportunity supports Qualcomm’s SoC engineering team and welcomes current graduates. Depending on interests, projects may involve RTL design, design verification, physical design, power, DFT, validation, AI/ML development, or engineering productivity. Interns gain experience across the SoC lifecycle while working alongside experienced engineers on mobile and data center computing platforms. Key Responsibilities:

Help develop next-generation Snapdragon® mobile platforms Contribute to Data Center SoC engineering projects Support RTL design, verification,



or physical implementation Participate in pre-silicon or post-silicon validation Apply AI-driven engineering and development workflows Requirements:

Study toward a technical bachelor’s or master’s degree Strong digital logic, computer architecture, or ASIC fundamentals One-plus years’ academic programming experience Familiarity with Verilog, SystemVerilog, C, C++, or Python Availability and graduation timing meeting program requirements Build Qualcomm semiconductor experience through hardware design, verification, validation, programming, and AI/ML engineering pathways.

📌 Hardware Engineering Intern Markham (Winnipeg)
🏢 Qualcomm
📍 Winnipeg