Embark on a transformative internship as a Digital Design Engineering Intern with Qualcomm in Toronto, Canada. Join a pioneering tech company and leverage your skills in hardware design to influence tomorrow's technology.

Qualcomm is seeking motivated Digital Design Engineering Interns for a 16-month program, beginning May/June 2027. This role focuses on high-speed interconnect solutions and requires skills in digital design, hardware languages, and analytical problem solving. Interns will gain hands-on experience and mentorship, working closely with a energetic team to deliver real-world impact.

Key Responsibilities:



• Learn fundamentals of High-Speed Interconnect and SerDes Design • Own the design implementation of new features • Assess specifications and devise implementation plans • Analyze design bugs through test failures • Collaborate cross-functionally with various engineering teams

Requirements: • Enrolled in Electrical/Computer Engineering or related field • Knowledge of Verilog/System Verilog and Python • Experience in digital logic and design methodologies • Expected graduation date of November 2028 or later • 1+ years of programming experience in C, C++, or Python

Contribute to innovative projects and enhance your engineering skills at Qualcomm, shaping the future of technology.

📌 Digital Design Engineering Intern at Qualcomm (Winnipeg)
🏢 QUALCOMM
📍 Winnipeg