Elevate your career as a Principal Advanced Optical Packaging Engineer at Ranovus in Ottawa, Ontario. Focus on cutting-edge optical technologies for AI and data-center connectivity in this full time role.In this pivotal position, you'll leverage your 10+ years of experience in advanced optical packaging and photonic assembly. You'll drive processes from development through to manufacturing transfer, working collaboratively with design teams, suppliers, and manufacturing partners. This hands-on role demands expertise in flip-chip and BGA assembly, fiber attachment, and thermal management.Key Responsibilities:
Develop packaging and assembly strategies based on product requirements
Lead flip-chip bonding and fine-pitch die attachment processes




Oversee hybrid integration of lasers and optical components
Manage fiber-array attach processes and inspection methods
Define tooling and SOPs for production ramp-upRequirements:
10+ years in advanced optical or semiconductor packaging
Hands-on flip-chip and optical alignment experience
Robust knowledge of materials and manufacturing processes
Proven ability to manage external partners
Excellent communication and technical judgmentBring your cutting-edge mindset and technical expertise to Ranovus and drive the future of optical packaging technology.#J-18808-Ljbffr

📌 Principal Optical Packaging Engineer In Ottawa
🏢 RANOVUS
📍 Ottawa