Explore hardware engineering through Qualcomm’s 2027 intern class in Markham, building Snapdragon® mobile and Data Center SoCs with digital design skills.
This interim engineering intern prospect supports Qualcomm’s SoC engineering team and welcomes new graduates. Depending on interests, projects may involve RTL design, design verification, physical design, power, DFT, validation, AI/ML development, or engineering productivity. Interns gain experience across the SoC lifecycle while working alongside experienced engineers on mobile and data center computing platforms.
Key Responsibilities: Help develop next-generation Snapdragon® mobile platforms
Contribute to Data Center SoC engineering projects
Support RTL design, verification, or physical implementation




Participate in pre-silicon or post-silicon validation
Apply AI-driven engineering and development workflows
Requirements: Study toward a technical bachelor’s or master’s degree
Strong digital logic, computer architecture, or ASIC fundamentals
One-plus years’ academic programming experience
Familiarity with Verilog, SystemVerilog, C, C++, or Python
Availability and graduation timing meeting program requirements
Build Qualcomm semiconductor experience through hardware design, verification, validation, programming, and AI/ML engineering pathways.

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📌 Hardware Engineering Intern Markham (Ontario)
🏢 Qualcomm
📍 Ontario