Duration: 12+ Months

Role Overview

- We are seeking a hands-on engineering technologist to support competitive analysis of notebook, desktop motherboard, and GPU platforms. The role combines advanced PCB rework, board-level reverse engineering, power instrumentation, component identification, BOM cost estimation, and PCB construction analysis.
- The successful candidate will modify densely populated laptop boards, perform fine-pitch BGA replacement and re-balling, and install current- and voltage-measurement connections for FPGA-based data-acquisition systems. Much of this work involves competitor hardware for which schematics, board-view files, and detailed design documentation are unavailable.
- Candidates with advanced smartphone or laptop motherboard repair experience, combined with solid electronics fundamentals and analytical skills, are encouraged to apply.

Job Duties

1. Competitive Platform and PCB Analysis

- Analyze CPU/APU/GPU PCBs from competitive platforms, including notebooks, PC motherboards, and graphics cards.
- Identify electrical components and reverse engineer board topology, architecture, power distribution, and key interfaces.
- Investigate boards without schematics using microscope inspection, component markings, available datasheets, continuity and resistance measurements, signal probing, and trace/via mapping.
- Identify voltage regulators, power stages, inductors, rail connections, and multiphase regulator arrangements.
- Compare competitor implementations with internal and customer designs to identify differences in component selection, integration, layout, and system architecture.

2. Precision Soldering, BGA Rework, and Board Modification





- Perform microscope-assisted soldering and rework on densely populated, multilayer laptop and graphics PCBs.
- Remove, re-ball, align, and replace fine-pitch BGA devices using appropriate rework equipment, thermal profiles, board support, and inspection methods.
- Remove and replace small surface-mount components and fine-pitch devices, including work in confined areas near sensitive components.
- Lift, reposition, and reinstall inductors and other power components to support current-measurement modifications.
- Perform pad and trace repair, fine-wire attachment, and circuit modifications while preserving PCB integrity and adjacent circuitry.
- Apply appropriate ESD precautions, thermal management, cleaning, and mechanical strain relief.
- Inspect completed work and verify electrical connectivity and platform functionality before and after modification.

3. Power Instrumentation and Benchmarking

- Determine suitable instrumentation points on boards where schematics and design documentation are generally unavailable.
- Install low-resistance current-sense shunts in selected power paths, with Kelvin sense connections and separate rail-voltage measurement leads.
- Instrument multiple power rails and regulator phases, including densely populated boards requiring modifications at eight or more inductor locations.




- Distinguish individual power rails from phases of a shared rail and document the corresponding measurement arrangement.
- Select or implement suitable shunt values in collaboration with the engineering team, considering current range, voltage drop, power dissipation, measurement sensitivity, and circuit impact.
- Route, secure, label, and connect measurement wiring to FPGA-based acquisition systems through the appropriate analog conditioning and Client circuitry.
- Verify channel mapping, calibration, signal quality, and repeatability, and assess whether board modifications affect platform operation.
- Measure power at system inputs and selected ASIC supply rails under standardized workloads to compare power consumption, performance, and efficiency.

4. Component Identification and BOM Cost Estimation

- Create and maintain estimated PCB bills of materials, including component identification, quantities, package types, and key electrical characteristics.
- Investigate components with unclear markings or specifications using available documentation, circuit context, and collaboration with component engineers.
- Use internal cost databases and available supplier information to estimate component and board costs.
- Compare competitor BOMs with internal and customer designs to identify cost drivers and opportunities for simplification or integration.
- Document assumptions and confidence levels for uncertain component identifications and cost estimates.
- Collaborate with component engineers, silicon vendors, and suppliers to clarify device characteristics and evaluate cost-effective alternatives.

5. PCB Stack-Up and Construction Analysis

- Coordina

📌 Platform Design Engineer # 26-28341 (Markham)
🏢 US Tech Solutions
📍 Markham