Senior Optical Packaging & Flip-Chip Process Architect - $145,000 - $165,000 A Year (Le Plateau-Mont-Royal)

Senior Optical Packaging & Flip-Chip Process Architect - $145,000 - $165,000 A Year (Le Plateau-Mont-Royal)

10 Nov
|
Sanmina-SCI Systems de México
|
Le Plateau-Mont-Royal

10 Nov

Sanmina-SCI Systems de México

Le Plateau-Mont-Royal

Lead process architecture and development for optical and microelectronic solutions. Define assembly strategies, develop recipes, and mentor engineers.

📌 Senior Optical Packaging & Flip-Chip Process Architect - $145,000 - $165,000 A Year (Le Plateau-Mont-Royal)
🏢 Sanmina-SCI Systems de México
📍 Le Plateau-Mont-Royal

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