Lead the forefront of optical and microelectronic process solutions at Advanced Microsystems Technologies. This senior role demands deep expertise in flip-chip and wire bonding, with a focus on hands-on innovation.At AMT, a division of Sanmina Corporation, you'll guide the process architecture for advanced products in RF and optical components. Collaborate with R&D; and manufacturing teams to define comprehensive assembly strategies and ensure alignment with device physics. Your technical leadership will bridge initial concepts to full-scale production, making a significant impact on emerging technologies.Key Responsibilities:
Define assembly strategies for complex optoelectronic modules
Lead development of process recipes, including flip-chip and wire bonding
Research,



procure, and oversee capital equipment testing
Provide DFx guidance to optimize yield and reliability
Serve as technical liaison during development, translating requirementsRequirements:
Master's Degree in Engineering fields
Minimum 8 years of microelectronics packaging experience
Expertise in flip-chip and wire bonding processes
Solid material science knowledge
Proficient in automated assembly equipment programmingShape the future of connectivity and make your mark with AMT in Kanata, ON.#J-18808-Ljbffr

📌 Microelectronics Process Engineer At Amt Ottawa (Canada)
🏢 Sanmina
📍 Canada