Shape high-speed electronics architectures at Teledyne Digital Imaging, applying mixed-signal design expertise to next-generation machine vision camera platforms. This Hardware Technical Leader role guides electronics direction across multiple platforms and programs. You will address analog, digital, mixed-signal, power, and high-speed design challenges. The work also involves PCB architecture, signal integrity, power integrity, and system integration.

Key Responsibilities
Set electronics architecture direction across machine vision camera platforms Architect board-level solutions for performance, scalability, and reliability Resolve complex analog, digital, power,



and high-speed challenges Establish design methodologies and engineering standards across teams Influence roadmaps and mentor multidisciplinary engineering teams

Requirements:
Expert analog, digital, mixed-signal, power, and high-speed design skills Deep PCB, signal integrity, power integrity, and integration knowledge Experience with ADCs, DACs, FPGAs, microcontrollers, and high-speed interfaces Ability to lead, influence, and mentor engineering teams Bachelor’s degree and typically 12+ years of relevant experience Apply architectural leadership and advanced electronics expertise to Teledyne Digital Imaging’s high-performance machine vision platforms. #J-18808-Ljbffr

📌 Senior Hardware Electronics Architect (Ontario)
🏢 Teledyne Technologies
📍 Ontario