Shape high-speed electronics architectures at Teledyne Digital Imaging, applying mixed-signal design expertise to next-generation machine vision camera platforms.

This Hardware Technical Leader role guides electronics direction across multiple platforms and programs. You will address analog, digital, mixed-signal, power, and high-speed design challenges. The work also involves PCB architecture, signal integrity, power integrity, and system integration.

Key Responsibilities:

- Set electronics architecture direction across machine vision camera platforms
- Architect board-level solutions for performance, scalability, and reliability
- Resolve complex analog, digital, power, and high-speed challenges
- Establish design methodologies and engineering standards across teams




- Influence roadmaps and mentor multidisciplinary engineering teams

Requirements:

- Expert analog, digital, mixed-signal, power, and high-speed design skills
- Deep PCB, signal integrity, power integrity, and integration knowledge
- Experience with ADCs, DACs, FPGAs, microcontrollers, and high-speed interfaces
- Ability to lead, influence, and mentor engineering teams
- Bachelor’s degree and typically 12+ years of relevant experience

Apply architectural leadership and advanced electronics expertise to Teledyne Digital Imaging’s high-performance machine vision platforms.

📌 Senior Hardware Electronics Architect (London)
🏢 Teledyne Technologies
📍 London