Build DSP and SoC verification skills as a Verification Engineering Intern with Qualcomm Canada ULC in Toronto, Canada.

Develop

SystemVerilog/UVM testbenches and debug simulations.This internship supports end-to-end verification of DSP-based SoC chips for high-speed connectivity products. You will learn DSP, SerDes, Ethernet, digital hardware, and verification methodologies with guidance from experienced engineers. The work spans specifications, planning, pre-silicon verification, and silicon validation.Key Responsibilities:

Develop SystemVerilog/UVM testbenches, tests, assertions, checkers, and coverageRun simulations and debug failures using Synopsys VCS and VerdiVerify DSP, SoC, interface, firmware,



and subsystem feature interactionsUse coverage to identify gaps and drive verification closureSupport post-silicon validation and laboratory activitiesRequirements:

Study toward a bachelor's degree in an engineering or computer science fieldAcademic programming experience with C, C++, Python, or similar languagesExperience with Verilog or SystemVerilog hardware description languagesFamiliarity with digital logic, computer architecture, DSP, or SoC designExpected graduation date of November 2028 or laterApply verification, programming, and debugging skills while contributing to Qualcomm DSP and SoC connectivity technologies in Toronto.

📌 Verification Engineering Intern Toronto (Winnipeg)
🏢 QUALCOMM
📍 Winnipeg