Location: Ottawa, Ontario | Type: Full-time

The Opportunity

Ranovus is seeking a Principal Advanced Optical Packaging Engineer to develop and industrialize packaging technologies for next-generation optical engines used in AI and data-center connectivity. This hands-on role covers package/process architecture, flip-chip and BGA assembly, hybrid laser integration, fiber attach, optical alignment, thermal-mechanical risk management, burn-in, tooling, automation, and manufacturing transfer. Working directly with design teams, equipment developers, suppliers, CMs, and OSAT partners.

What You Will Own

- Package & Process Architecture: Translate product requirements into packaging/assembly strategies; define build sequences, inspection points, rework, and test gates; lead DFM/DFA/DFT/DFR reviews; identify risks and drive DOEs/qualification.
- Flip-Chip, Die Attach & Electrical Integration: Develop/qualify flip-chip and fine-pitch die-attach processes (copper-pillar, BGA, LGA, WLCSP); define reflow, solder paste, flux, and cleaning approaches; manage warpage, CTE mismatch, and voiding; develop underfill/encapsulation processes; define AOI, X-ray, and cross-section inspection methods.
- Laser Packaging & Hybrid Integration: Lead hybrid laser-to-carrier and laser-to-ePIC assembly process development; work with laser die, lenses, isolators, and couplers; define alignment, attachment, and burn-in/test flows; manage supplier specs for laser components.
- Fiber Attach & Optical I/O: Develop repeatable fiber-array attach processes (single-mode, PM fiber,



multi-fiber arrays); define alignment strategy, adhesive/cure processes, and loss-control methods; support automated fiber-attach station development (motion, vision, dispensation, calibration).
- Thermal-Mechanical & Materials: Evaluate thermal paths and manage package stress/warpage/CTE mismatch; select and qualify solders, underfills, adhesives, TIMs, and encapsulants; partner with mechanical/simulation specialists.
- NPI & Manufacturing Transfer: Lead processes from POC through NPI, qualification, and production ramp; define tooling, SOPs, PFMEAs, and control plans; drive root-cause/corrective action; decide what stays in-house vs. transfers to partners

Required Experience

- 10+ years in advanced optical packaging, photonic packaging, optoelectronic assembly, semiconductor packaging, or precision micro-assembly.
- Demonstrated ownership of packaging processes from development through NPI/production transfer.
- Hands-on experience in several flip-chip bonding, fine-pitch die attach, copper-pillar/solder-bump interconnect, BGA/LGA assembly, substrate/interposer integration, laser die/subassembly packaging, fiber-array attach, active/passive optical alignment, underfill/encapsulation/adhesive processes.




- Solid grasp of how optical, mechanical, thermal, electrical, material, and manufacturing requirements interact in an optoelectronic package.
- Practical knowledge of soldering, wetting, flux, intermetallics, surface finishes, underfill, adhesives, curing, and contamination control.
- Experience with DOEs, process characterization, qualification builds, and failure analysis.
- Experience defining process windows, inspection criteria, and manufacturing controls.
- Ability to distinguish lab demonstrations from robust, transferable manufacturing processes.
- Experience with external manufacturing partners, equipment suppliers, or component vendors.
- Strong technical judgment and communication skills.

Particularly Valuable Experience

- Laser/laser-array/hybrid laser-photonic subassembly packaging; co-packaged or external laser sources.
- Single-mode edge coupling, lensed coupling, mode-field conversion, isolators, turning optics.
- Laser characterization, chip-on-carrier test, burn-in, reliability qualification.
- Silicon photonics packaging for transceivers/optical engines (800G–6.4T+).
- Automated optical alignment equipment (e.g., FiconTEC); motion control, machine vision, force sensing, UV curing.
- Organic substrates, advanced interposers, high-density BGA connectors.
- Thermal-mechanical modeling (warpage, stress, CTE, solder-joint reliability).
- SPC, MSA, GR&R;, Cp/Cpk, yield improvement.
- CAD experience (SolidWorks or comparable).

Educati

📌 Principal Advanced Optical Packaging Engineer (Ottawa)
🏢 RANOVUS
📍 Ottawa