Design high-speed packages and PCBs at Semtech Corporation, applying advanced EDA tools and electronic design expertise to connectivity products.
This Senior Package and PCB Layout Engineer supports the Signal Integrity Products business unit’s R&D; hardware design team. The work includes feasibility assessments, multilayer layouts, and wafer-level interconnect designs. You will contribute across 2D, 2.5D, and 3D IC configurations while coordinating with engineering teams and suppliers.
Key Responsibilities
Perform package design feasibility assessments for signal integrity expertsDevelop multilayer substrate and carrier layoutsSupport 2D, 2.5D,
and 3D IC configurationsDevelop wafer-level interconnect layouts using redistribution layersCoordinate with manufacturing and thermomechanical engineering teamsRequirements: Bachelor’s degree in engineering, physics, or relevant disciplineFive years of high-speed package or advanced PCB layout experienceSolid knowledge of high-speed layout and electronic designAdvanced knowledge of EDA layout toolsFamiliarity with RF, analog, digital, thermal, and optical designApply package layout, PCB expertise, and advanced EDA knowledge to creative high-speed designs at Semtech Corporation. #J-18808-Ljbffr