Build DSP and SoC verification skills as a Verification Engineering Intern with Qualcomm Canada ULC in Toronto, Canada. Develop SystemVerilog/UVM testbenches and debug simulations. This internship supports end-to-end verification of DSP-based SoC chips for high-speed connectivity products. You will learn DSP, SerDes, Ethernet, digital hardware, and verification methodologies with guidance from experienced engineers. The work spans specifications, planning, pre-silicon verification, and silicon validation. Key Responsibilities:

Develop SystemVerilog/UVM testbenches, tests, assertions, checkers, and coverage Run simulations and debug failures using Synopsys VCS and Verdi Verify DSP, SoC, interface, firmware,



and subsystem feature interactions Use coverage to identify gaps and drive verification closure Support post-silicon validation and laboratory activities Requirements:

Study toward a bachelor's degree in an engineering or computer science field Academic programming experience with C, C++, Python, or similar languages Experience with Verilog or SystemVerilog hardware description languages Familiarity with digital logic, computer architecture, DSP, or SoC design Expected graduation date of November 2028 or later Apply verification, programming, and debugging skills while contributing to Qualcomm DSP and SoC connectivity technologies in Toronto.

📌 Verification Engineering Intern Toronto
🏢 QUALCOMM
📍 Toronto