Design high-speed packages and PCBs at Semtech Corporation, applying advanced EDA tools across creative semiconductor connectivity solutions. Support interconnect technologies within an R&D; hardware design team.
This Package and PCB Layout Engineer contributes to the Signal Integrity Products business unit. The work includes feasibility assessments, multi-layer substrate layouts, and wafer-level interconnect designs. Collaboration spans signal integrity experts, manufacturing, thermo-mechanical engineering teams, and suppliers.

Key Responsibilities

Perform package design feasibility assessments for signal integrity expertsDevelop multi-layer substrate and carrier layoutsSupport 2D, 2.5D,



and 3D IC configurationsDevelop wafer-level interconnect layouts using redistribution layersCoordinate designs with manufacturing and thermo-mechanical engineering teamsRequirements:
Bachelor’s degree in engineering, physics, or relevant disciplineFive years of high-speed package or advanced PCB layout experienceSolid knowledge of high-speed layout and electronic designAdvanced knowledge of EDA layout toolsUnderstanding of RF, analog, and digital circuitsApply package layout, PCB expertise, and advanced EDA knowledge to high-speed designs at Semtech’s Signal Integrity Products business unit.
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📌 Senior Package And Pcb Layout Engineer (Winnipeg)
🏢 Sierra Wireless
📍 Winnipeg