Build DSP and SoC verification skills as a Verification Engineering Intern with Qualcomm Canada ULC in Toronto, Canada. Develop SystemVerilog/UVM testbenches and debug simulations.
This internship supports end-to-end verification of DSP-based SoC chips for high-speed connectivity products. You will learn DSP, SerDes, Ethernet, digital hardware, and verification methodologies with guidance from experienced engineers. The work spans specifications, planning, pre-silicon verification, and silicon validation.
Key Responsibilities: Develop SystemVerilog/UVM testbenches, tests, assertions, checkers, and coverage
Run simulations and debug failures using Synopsys VCS and Verdi
Verify DSP, SoC, interface, firmware, and subsystem feature interactions
Use coverage to identify gaps and drive verification closure




Support post-silicon validation and laboratory activities
Requirements: Study toward a bachelor's degree in an engineering or computer science field
Academic programming experience with C, C++, Python, or similar languages
Experience with Verilog or SystemVerilog hardware description languages
Familiarity with digital logic, computer architecture, DSP, or SoC design
Expected graduation date of November 2028 or later
Apply verification, programming, and debugging skills while contributing to Qualcomm DSP and SoC connectivity technologies in Toronto.

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📌 Verification Engineering Intern Toronto (Ontario)
🏢 QUALCOMM
📍 Ontario