Design high-speed packages and PCBs at Semtech Corporation, applying advanced EDA tools across cutting-edge semiconductor connectivity solutions. Support interconnect technologies within an R&D; hardware design team. This Package and PCB Layout Engineer contributes to the Signal Integrity Products business unit. The work includes feasibility assessments, multi-layer substrate layouts, and wafer-level interconnect designs. Collaboration spans signal integrity experts, manufacturing, thermo-mechanical engineering teams, and suppliers. Key Responsibilities:

Perform package design feasibility assessments for signal integrity experts Develop multi-layer substrate and carrier layouts Support 2D, 2.5D,



and 3D IC configurations Develop wafer-level interconnect layouts using redistribution layers Coordinate designs with manufacturing and thermo-mechanical engineering teams Requirements:

Bachelor’s degree in engineering, physics, or relevant discipline Five years of high-speed package or advanced PCB layout experience Solid knowledge of high-speed layout and electronic design Advanced knowledge of EDA layout tools Understanding of RF, analog, and digital circuits Apply package layout, PCB expertise, and advanced EDA knowledge to high-speed designs at Semtech’s Signal Integrity Products business unit.

📌 Senior Package and PCB Layout Engineer (Calgary)
🏢 Sierra Wireless
📍 Calgary