Design high-speed packages and PCBs at Semtech Corporation, applying advanced EDA tools across cutting-edge semiconductor connectivity solutions. Support interconnect technologies within an R&D; hardware design team.

This Package and PCB Layout Engineer contributes to the Signal Integrity Products business unit. The work includes feasibility assessments, multi-layer substrate layouts, and wafer-level interconnect designs. Collaboration spans signal integrity experts, manufacturing, thermo-mechanical engineering teams, and suppliers.

Key Responsibilities:

- Perform package design feasibility assessments for signal integrity experts
- Develop multi-layer substrate and carrier layouts
- Support 2D, 2.5D, and 3D IC configurations




- Develop wafer-level interconnect layouts using redistribution layers
- Coordinate designs with manufacturing and thermo-mechanical engineering teams

Requirements:

- Bachelor’s degree in engineering, physics, or relevant discipline
- Five years of high-speed package or advanced PCB layout experience
- Solid knowledge of high-speed layout and electronic design
- Advanced knowledge of EDA layout tools
- Understanding of RF, analog, and digital circuits

Apply package layout, PCB expertise, and advanced EDA knowledge to high-speed designs at Semtech’s Signal Integrity Products business unit.

📌 Senior Package and PCB Layout Engineer (Calgary)
🏢 Sierra Wireless
📍 Calgary