02 Nov
|
Broadcom
|
Le Plateau-Mont-Royal
02 Nov
Broadcom
Le Plateau-Mont-Royal
Lead high-speed hardware design using 25Gbps interfaces, multi-layer PCBs, and signal-integrity analysis in a technical leadership capacity. This Lead Hardware Engineer role requires 8+ years of direct electronics design experience and 2+ years as a technical lead. The work spans requirements, architecture, schematic capture, PCB layout, verification, and manufacturing. You will address digital, analog, RF, and power considerations across hardware products. Key Responsibilities: Develop high-speed digital and multi-layer PCB designs Manage hardware requirements through manufacturing Analyze signal integrity and verify hardware designs Debug circuits using scopes, VNAs, and signal generators Support eye-diagram and signal-quality analysis Requirements: 8+ years of direct electronics design experience 2+ years serving as a technical lead Bachelor's degree in EE or CE, or equivalent Experience with 25Gbps+ interfaces and SerDes Familiarity with ESD, EMI, and RF design considerations Apply high-speed design, debugging, and technical leadership experience across complex electronics development and verification activities. #J-18808-Ljbffr
📌 Hybrid Hardware Engineer – Embedded Telecom Systems (Le Plateau-Mont-Royal)
🏢 Broadcom
📍 Le Plateau-Mont-Royal