Job Title: Microelectronics Process Engineer Job Description This role focuses on developing and owning advanced microelectronics assembly processes for complex optoelectronic modules and related products.

You will combine hands-on process engineering with process architecture responsibilities, translating customer needs into robust manufacturing requirements.

Working within an R&D; organization that closely collaborates with manufacturing, you will help drive technologies that support data center infrastructure as well as industrial, medical, and aerospace applications.

Responsibilities Conceptualize and define assembly strategies for complex optoelectronic modules, ensuring alignment with performance, reliability, and manufacturability goals.

Lead hands-on development, optimization, and documentation of critical process recipes for microelectronics assembly.

Own key processes end to end, acting as a process architect by allocating process elements to be developed and maintained across the team.

Procure, evaluate, and qualify capital equipment in accordance with technology roadmaps and process requirements.

Translate customer requirements into clear manufacturing specifications and process guidelines.

Provide design-for-manufacturing and design-for-test (DFx) guidance to optimize yield and reliability prior to prototype builds.

Apply statistical process control and data analysis methods to monitor, control, and improve process performance.

Develop, author, and approve high-level process documentation, qualification plans, and qualification reports.

Mentor junior engineers by providing technical guidance on microelectronics processes, materials interactions, and process control methods.

Collaborate closely with R&D; and manufacturing teams to ensure smooth technology transfer and scalable production.

Essential Skills Bachelors degree or higher in a relevant engineering field. 8+ years of direct experience in microelectronics.

At least 2 years of demonstrable process ownership or process architect experience, including end-to-end responsibility for specific processes.

Expert knowledge of flip-chip assembly processes.

Expert knowledge of wire bonding processes.





Hands-on experience with surface mount technology (SMT).

Experience with reflow soldering and solder interconnect processes.

Experience with electrical interconnect technologies in microelectronics assemblies.

Familiarity with material interaction in microelectronics assemblies and related process control methods.

Experience with statistical process control (SPC) and data analysis for process monitoring and improvement.

Additional Skills & Qualifications Experience with underfill processes in flip-chip and advanced packaging applications.

Experience in process engineering within R&D; environments that interface with manufacturing.

Exposure to optoelectronic modules and optics-related packaging is beneficial.

Experience supporting applications in data centers, industrial systems, medical devices, or aerospace products.

Strong technical communication skills for authoring and approving documentation and qualification reports.

Ability to provide DFx guidance to improve yield and manufacturability before prototype builds.

Demonstrated ability to mentor and support junior engineers in process development activities.

Work Environment You will work primarily in a laboratory environment that is closely integrated with a manufacturing setting.

The role sits within an R&D; group that actively collaborates with production teams to industrialize new processes and technologies.

The group focuses on solutions that support data center and related infrastructure, with additional design and manufacturing activities for industrial, medical, and aerospace applications.

You can expect hands-on work with microelectronics assembly equipment such as SMT lines, reflow tools, flip-chip and wire bonding systems, and related inspection and test equipment.

The setting emphasizes process ownership,



cross-functional collaboration, and continuous improvement, with appropriate lab attire and safety practices required when working on the production floor or in the lab.

Job Type & Location This is a Permanent position based out of Kanata, ON.

Pay and Benefits The pay range for this position is $110000.00 - $160000.00/yr.

Individual compensation offered for this position within this range will depend on many factors, including qualifications, skills, relevant experience, job knowledge, geographic location, internal equity, and other pertinent job-related factors.

Job Type & Location This is a Permanent position based out of Kanata, ON.

Workplace Type This is a fully onsite position in Kanata,ON. À propos d'Actalent Actalent est un leader mondial dans les services dingénierie et de sciences ainsi que dans les solutions de talents.

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📌 Microelectronics Process Engineer (Kanata)
🏢 Actalent
📍 Kanata