Elevate your career as a Principal Advanced Optical Packaging Engineer at Ranovus in Ottawa, Ontario. Focus on cutting-edge optical technologies for AI and data-center connectivity in this full time role.In this pivotal position, you'll leverage your 10+ years of experience in advanced optical packaging and photonic assembly. You'll drive processes from development through to manufacturing transfer, working collaboratively with design teams, suppliers, and manufacturing partners. This hands-on role demands expertise in flip-chip and BGA assembly, fiber attachment,
and thermal management.Key Responsibilities:- Develop packaging and assembly strategies based on product requirements- Lead flip-chip bonding and fine-pitch die attachment processes- Oversee hybrid integration of lasers and optical components- Manage fiber-array attach processes and inspection methods- Define tooling and SOPs for production ramp-upRequirements:- 10+ years in advanced optical or semiconductor packaging- Hands-on flip-chip and optical alignment experience- Strong knowledge of materials and manufacturing processes- Proven ability to manage external partners- Excellent communication and technical judgmentBring your innovative mindset and technical expertise to Ranovus and drive the future of optical packaging technology.#J-18808-Ljbffr