Develop high-speed hardware and electrical modeling onsite at Semtech’s Burlington, Ontario Design Center, using Cadence Allegro and leading-edge design tools. Contribute to semiconductor product evaluation.

This student internship places you within Semtech’s Hardware Design group for up to 16 months. You will contribute to cutting-edge board design and assembly supporting semiconductor performance measurement. The work spans internal and customer-facing hardware, card design, electrical modeling, and signal integrity optimization. You will collaborate with product development, applications, mechanical, and other cross-functional teams. The schedule requires office attendance Monday through Thursday for a 40-hour work week.

Key Responsibilities:
Perform system-level signal integrity analysis and optimization




Develop high-speed board designs and assemblies
Work with product development and applications teams
Support fixtures, housings, and thermal solutions
Use Autodesk Fusion for mechanical design support

Requirements:
Experience with Autodesk Fusion for mechanical design
Familiarity with high-speed digital design above 10Gbps
Knowledge of optical and high-speed test equipment
Excellent cross-functional teamwork and leadership skills
Customer-focused, motivated, goal-driven self-starter

Grow through direct involvement in high-speed board design, electrical modeling, and cross-functional semiconductor development at Semtech.

📌 High Speed Hardware Design Intern Burlington
🏢 Semtech
📍 Burlington