Design high-speed packages and PCBs at Semtech Corporation, applying advanced EDA tools and electronic design expertise to connectivity products. This Senior Package and PCB Layout Engineer supports the Signal Integrity Products business unit’s R&D; hardware design team. The work includes feasibility assessments, multilayer layouts, and wafer-level interconnect designs. You will contribute across 2D, 2.5D, and 3D IC configurations while coordinating with engineering teams and suppliers. Key Responsibilities:

Perform package design feasibility assessments for signal integrity experts Develop multilayer substrate and carrier layouts Support 2D, 2.5D,



and 3D IC configurations Develop wafer-level interconnect layouts using redistribution layers Coordinate with manufacturing and thermomechanical engineering teams Requirements:

Bachelor’s degree in engineering, physics, or relevant discipline Five years of high-speed package or advanced PCB layout experience Solid knowledge of high-speed layout and electronic design Advanced knowledge of EDA layout tools Familiarity with RF, analog, digital, thermal, and optical design Apply package layout, PCB expertise, and advanced EDA knowledge to cutting-edge high-speed designs at Semtech Corporation.

📌 Senior Package and PCB Layout Engineer (Burlington)
🏢 Semtech
📍 Burlington