Develop high-speed hardware and electrical modeling onsite at Semtech’s Burlington, Ontario Design Center, using Cadence Allegro and leading-edge design tools. Contribute to semiconductor product evaluation.
This student internship places you within Semtech’s Hardware Design group for up to 16 months. You will contribute to creative board design and assembly supporting semiconductor performance measurement. The work spans internal and customer-facing hardware, card design, electrical modeling, and signal integrity optimization. You will collaborate with product development, applications, mechanical, and other cross-functional teams. The schedule requires office attendance Monday through Thursday for a 40-hour work week.
Key Responsibilities:
- Perform system-level signal integrity analysis and optimization
- Develop high-speed board designs and assemblies
- Work with product development and applications teams
- Support fixtures, housings, and thermal solutions
- Use Autodesk Fusion for mechanical design support
Requirements:
- Experience with Autodesk Fusion for mechanical design
- Familiarity with high-speed digital design above 10Gbps
- Knowledge of optical and high-speed test equipment
- Excellent cross-functional teamwork and leadership skills
- Customer-focused, motivated, goal-driven self-starter
Grow through direct involvement in high-speed board design, electrical modeling, and cross-functional semiconductor development at Semtech.