Develop high-speed hardware and electrical modeling onsite at Semtech’s Burlington, Ontario Design Center, using Cadence Allegro and leading-edge design tools. Contribute to semiconductor product evaluation.
This student internship places you within Semtech’s Hardware Design group for up to 16 months. You will contribute to creative board design and assembly supporting semiconductor performance measurement. The work spans internal and customer-facing hardware, card design, electrical modeling, and signal integrity optimization. You will collaborate with product development, applications, mechanical, and other cross-functional teams. The schedule requires office attendance Monday through Thursday for a 40-hour work week.
Key Responsibilities: Perform system-level signal integrity analysis and optimization




Develop high-speed board designs and assemblies
Work with product development and applications teams
Support fixtures, housings, and thermal solutions
Use Autodesk Fusion for mechanical design support
Requirements: Experience with Autodesk Fusion for mechanical design
Familiarity with high-speed digital design above 10Gbps
Knowledge of optical and high-speed test equipment
Excellent cross-functional teamwork and leadership skills
Customer-focused, motivated, goal-driven self-starter
Grow through direct involvement in high-speed board design, electrical modeling, and cross-functional semiconductor development at Semtech.

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📌 High Speed Hardware Design Intern (Ontario)
🏢 Semtech
📍 Ontario