Senior Microelectronics Packaging Engineer (Northside)

Senior Microelectronics Packaging Engineer (Northside)

30 Oct
|
Actalent
|
Northside

30 Oct

Actalent

Northside

Actalent in Ottawa is seeking a Microelectronics Packaging Design Engineer to lead the development of advanced microelectronic and packaging solutions across RF, optical, reliability, and process engineering disciplines. You will design and engineer packages, manage BOMs and documentation, mentor junior staff, and engage with customers while contributing to proposals and quotations for creative packaging solutions.

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📌 Senior Microelectronics Packaging Engineer (Northside)
🏢 Actalent
📍 Northside

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