Apply PCB layout and signal integrity skills as a student intern at Semtech Corporation’s Burlington Design Center. Work in office Monday through Thursday.
As part of the Hardware Design group, you will develop high-speed boards and assemblies for semiconductor performance measurement. The internship lasts up to 16 months and supports internal and customer-facing hardware. You will collaborate with product development, applications, and cross-functional teams while gaining exposure to design tools and technologies.
Key Responsibilities: Develop evaluation platforms with senior hardware engineers
Perform schematic capture and PCB layout
Analyze and optimize system-level signal integrity
Support fixtures, housings, and thermal solution design
Coordinate evaluation platform development across internal teams
Requirements: Experience with Cadence Allegro for PCB layout
Experience with Autodesk Fusion for mechanical design
Familiarity with RF and high-speed digital design above 10Gbps
Knowledge of optical and high-speed test equipment
Strong debugging, communication, and organizational skills
Build practical experience in PCB layout, electrical modeling, and high-speed hardware development with Semtech’s Hardware Design team.