Lead the way in IC Package Design at Semtech as a Principal Engineer focused on Signal Integrity. Your experience in high-speed transmission and cooperative design will be vital in this pivotal role.
Join Semtech's Signal Integrity Products team to spearhead the design and characterization of high-speed packages for data communications. Your role encompasses advanced modeling and cross-functional collaboration to ensure excellent quality and reliability. This is an extraordinary chance to contribute to the evolution of data center technologies.
Key Responsibilities: - Oversee design and development of IC packages and COB solutions - Conduct 3D signal integrity modeling,



validating with TDR and S-parameter testing - Write technical reports for both internal and external stakeholders - Create PCB layouts for performance and reliability - Mentor junior engineers in design methodologies and tools
Requirements: - Bachelor's degree in Electrical Engineering or related field - Over 8 years of experience in signal integrity or IC package design - Proficiency with EDA tools and measurement equipment - Familiarity with various advanced packaging methods - Ability to manage technical relationships with suppliers
Your expertise will help shape a recent era in high-performance connectivity products at Semtech.#J-18808-Ljbffr

📌 Principal Engineer For Signal Integrity Winnipeg (Canada)
🏢 Semtech
📍 Canada