Job Title: Microelectronics Packaging Design Engineer in Ottawa Job Description The Microelectronics Packaging Design Engineer leads the development of advanced microelectronic and packaging solutions within a multidisciplinary environment that includes RF, optical, reliability, and process engineering.

This role focuses on designing and engineering microelectronic packages and modules, integrating material selection, substrate layout, thermal and mechanical analysis, and design for manufacturing.

The engineer evaluates industry trends to define microelectronic technologies and design concepts that meet customer requirements and align with emerging market standards, while overseeing supplier specifications, documentation, and lifecycle management.

The position also provides technical mentorship, interfaces directly with customers and stakeholders, and supports business development through technical proposals and quotations for innovative engineering solutions.

Responsibilities Provide technical leadership for microelectronic and advanced packaging solutions within a multidisciplinary team that includes RF, optical, reliability, and process engineering experts.

Engineer microelectronic packages and modules by integrating material selection, substrate layout, thermal and mechanical analysis, and design for manufacturing principles.

Evaluate industry trends and emerging technologies to select appropriate microelectronic solutions and define design concepts that align with specific customer requirements and market standards.

Define detailed specifications for custom outsourced components and manage the complete documentation lifecycle, including bills of materials (BOMs), assembly drawings, and Engineering Change Orders (ECO).

Lead and mentor junior members of the microelectronics design team, providing technical oversight, guidance, and support in day-to-day engineering activities.

Interface directly with customers, internal leadership, and project stakeholders to communicate technical development updates, address issues, and report project status.

Support business development efforts by engaging with prospective customers, preparing technical proposals, and drafting quotations for novel microelectronic and packaging engineering solutions.

Collaborate across the full product lifecycle, from concept and design through prototyping and high-volume manufacturing, ensuring robust and manufacturable package designs.

Apply design for manufacturing (DFM) best practices and reliability considerations to ensure that microelectronic packages meet performance,



quality, and production requirements.

Utilize CAD tools such as AutoCAD and Solid

Works, along with FEA and packaging design software, to create, analyze, and optimize microelectronic package designs.

Contribute to documentation and communication by distilling complex technical data into clear, concise updates for stakeholders and customers.

Essential Skills Bachelors degree in Mechanical Engineering, Physics, or a related technical discipline.

Minimum of 12 years of relevant industry experience in electronic hardware design and semiconductor advanced packaging.

Extensive experience in microelectronic and advanced packaging technologies, materials, components, and manufacturing methods.

Proven track record of technical leadership in end-to-end product development programs, from prototype through volume manufacturing.

Expert-level proficiency in AutoCAD and Solid

Works for mechanical and packaging design.

Experience using commercial Finite Element Analysis (FEA) tools for thermal and mechanical analysis of microelectronic packages.

Strong knowledge of microelectronics and advanced chip packaging, including flip chip, organic packages, and wafer-level technologies.

Experience applying design for manufacturing (DFM) principles to microelectronic packages and modules.

Ability to create and manage detailed technical documentation, including BOMs, assembly drawings, and ECOs.

Exceptional verbal and written communication skills, with the ability to distill complex technical information into concise updates for stakeholders and customers.

Ability to manage multiple high-priority programs simultaneously while maintaining quality and meeting deadlines.

Additional Skills & Qualifications Experience with Cadence Allegro Package Designer Plus or similar packaging design software is an asset.

Familiarity with optical and RF communications, quantum computing, medical devices, automotive sensing, and datacenter connectivity applications.

Experience working with reliability testing, MEMS, and optical technologies in the context of microelectronic packaging.

Experience collaborating within multidisciplinary teams that include RF,



optical, reliability, and process engineering.

Demonstrated ability to support business development activities through technical proposals and quotations for advanced engineering solutions.

Work Workplace This role is fully on-site and offers the opportunity to work hands-on with cutting-edge microelectronic packaging technologies.

You will collaborate closely with experts across RF, optical, reliability, and process engineering throughout the full product lifecycle, from concept and design to prototyping and high-volume manufacturing.

Job Type & Location This is a Permanent position based out of Kanata, ON.

Pay and Benefits The pay range for this position is $110000.00 - $160000.00/yr.

Individual compensation offered for this position within this range will depend on many factors, including qualifications, skills, relevant experience, job knowledge, geographic location, internal equity, and other pertinent job-related factors.

Job Type & Location This is a Permanent position based out of Kanata, ON.

Workplace Type This is a fully onsite position in Kanata,ON. À propos d'Actalent Actalent est un leader mondial dans les services dingénierie et de sciences ainsi que dans les solutions de talents.

Nous aidons des entreprises visionnaires à faire progresser leurs initiatives dingénierie et de science grâce à laccès à des experts spécialisés qui favorisent léchelle, linnovation et la rapidité de mise sur le marché.

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📌 Microelectronics Packaging Design Engineer (Kanata)
🏢 Actalent
📍 Kanata