Elevate semiconductor packaging projects with onsemi as a Modeling and Simulation Engineer in Waterloo, Ontario. Utilize thermal-mechanical simulations to support creative power module developments. Join onsemi's Corporate R&D; team as a Semiconductor Packaging Modeling and Simulation Engineer. This critical role demands expertise in thermal-mechanical simulation, problem analysis, and the Ag/Cu sintering process. You will analyze reliability issues, develop cutting-edge methodology, and collaborate on thermal modeling for safety and efficiency.

Key Responsibilities
• Conduct thermal-mechanical simulations for microelectronic packaging
• Analyze reliability issues due to thermal problems
• Develop innovative simulation methodologies using AI and Digital Twin




• Maintain HW/SW environments for effective modeling
• Support team members on thermal modeling projects

Requirements:
• Master’s or Ph.
D. in Physics or Engineering
• 2-3+ years of experience in thermal and mechanical modeling
• Strong knowledge of CAD, Solidworks, and FEA software
• Familiarity with semiconductor packaging processes
• Excellent English communication skills Harness your expertise in modeling and simulation to empower onsemi's commitment to energy-efficient innovations.

📌 Modeling and Simulation Engineer at onsemi (London)
🏢 Onsemi
📍 London