Apply PCB layout and high-speed design skills onsite at Semtech Corporation’s Burlington Design Center, working Monday to Thursday each week. Support semiconductor performance measurement through board development.
As a student intern within the Hardware Design group, you will help develop high-speed boards and assemblies for semiconductor products. The internship may last up to 16 months and involves schematic capture, signal integrity analysis, and PCB layout. You will work with senior engineers and product development and applications teams, locally and remotely. Your work will support internal and customer-facing hardware and evaluation platforms.
Key Responsibilities:
- Develop evaluation platforms with senior hardware engineers
- Perform schematic capture and PCB layout
- Optimize system-level signal integrity performance
- Apply manufacturing design rules and bills of material
- Support evaluation platform development across internal teams
Requirements:
- Experience with Cadence Allegro for PCB layout
- Solid debugging skills
- Familiarity with RF and digital designs above 10Gbps
- Knowledge of optical and high-speed test equipment
- Good communication and organizational skills
Build experience in PCB layout, signal integrity, and evaluation hardware at Semtech’s Burlington Design Center onsite.