Lead the way in IC Package Design at Semtech as a Principal Engineer focused on Signal Integrity. Your experience in high-speed transmission and collaborative design will be vital in this pivotal role. Join Semtech's Signal Integrity Products team to spearhead the design and characterization of high-speed packages for data communications.

Your role encompasses advanced modeling and cross-functional collaboration to ensure excellent quality and reliability. This is an extraordinary chance to contribute to the evolution of data center technologies. Key Responsibilities:

- Oversee design and development of IC packages and COB solutions
- Conduct 3D signal integrity modeling, validating with TDR and S-parameter testing
- Write technical reports for both internal and external stakeholders




- Create PCB layouts for performance and reliability
- Mentor junior engineers in design methodologies and tools

Requirements:

- Bachelor's degree in Electrical Engineering or related field
- Over 8 years of experience in signal integrity or IC package design
- Proficiency with EDA tools and measurement equipment
- Familiarity with various advanced packaging methods
- Ability to manage technical relationships with suppliers

Your expertise will help shape a recent era in high-performance connectivity products at Semtech.

📌 Principal Engineer for Signal Integrity (Calgary)
🏢 Semtech
📍 Calgary