At Blue Origin, we envision millions of people living and working in space for the benefit of Earth. We’re working to develop reusable, safe, and low-cost space vehicles and systems within a culture of safety, collaboration, and inclusion. Join our team of problem solvers as we add recent chapters to the history of spaceflight

Avionics Mechanical Design & Analysis Engineer III

Core Systems & Components | Blue National Security

Build the Hardware That Protects Space Missions

Space is unforgiving — extreme temperatures, violent vibration and shock, radiation, and vacuum. The electronics that fly on Blue Origin spacecraft have to survive all of it, and that’s where you come in. We’re looking for an experienced avionics packaging engineer to own ruggedized enclosures and mechanical systems from concept through flight release — not just contribute to pieces of the job, but drive it.

This role requires anactive Top Secret (TS) security clearance. Current SCI access, or eligibility and willingness to obtain SCI access, is preferred.

The Mission

Blue Origin is building the infrastructure for humanity’s future in space. Every avionics box you design protects the systems that keep vehicles safe and missions on track. You’ll work at the intersection of mechanical design, electrical integration, and space-environment survival — alongside a curious, collaborative team that takes pride in getting the hard problems right.

Your Impact

As an Avionics Mechanical Design and Analysis Engineer III, you’ll lead development of the protective mechanical systems for spacecraft avionics — shielding sensitive electronics from thermal extremes, vibration, shock, radiation, EMI, and vacuum.



Your technical calls will shape system reliability, vehicle integration, manufacturability, and mission success.

What You’ll Do

- Own complex avionics packaging assemblies—including enclosures, chassis, and mounting systems—across the full lifecycle: requirements, design, analysis, verification, qualification, release, and production support.

- Partner with electrical, systems, thermal, structures, manufacturing, quality, and test engineers to architect integrated packaging solutions for PCBAs, connectors, and harnessing.

- Drive thermal, structural, vibration, shock, and fatigue analyses, and lead trade studies balancing mass, thermal and structural performance, EMI/EMC protection, manufacturability, cost, schedule, and risk.

- Deliver high-quality models, drawings, specifications, interface control documents, and configuration-controlled release packages.

- Apply GD&T; in accordance with ASME Y14.5 to enable effective manufacturing, assembly, inspection, and integration.

- Shape environmental test campaigns end-to-end, including planning, hardware preparation, data review, anomaly investigation, root-cause analysis, and verification closeout.

- Mentor less-experienced engineers, lead design reviews,



and engage suppliers through design changes and configuration management.

- Perform work in accordance with all applicable security requirements and protect classified information, controlled technical data, and other program-sensitive materials.

What You Bring

- B.S. in Mechanical Engineering, Aerospace Engineering, or a related engineering discipline.

- 5+ years of experience designing electromechanical assemblies, avionics packaging, or comparable aerospace hardware.

- A track record of owning mechanical designs through the full lifecycle, from requirements definition through production support.

- Active Top Secret (TS) security clearance.

- Strong 3D CAD skills; Creo/Pro-E experience is a plus.

- Solid command of GD&T; and ASME Y14.5 drawing practices.

- Experience integrating PCBAs, connectors, and cable/harness interfaces into mechanical assemblies.

- Knowledge of ruggedized electronics design, including thermal management, structural protection, vibration and shock survival, vacuum compatibility, and EMI/EMC shielding.

- Experience conducting or directing thermal and structural analyses for electronic packaging.

- Ability to independently manage multiple priorities, clearly communicate technical risk, and thrive in a cross-functional environment.

Bonus Points For

- Current SCI access, or eligibility and willingness to obtain SCI access.

- M.S. in Mechanical Engineering, Aerospace Engineering, or a related discipline.

- Hands-on electronics thermal, structural, vibration, shock, or fatigue-analysis experience; familiarity with solder-fatigue methods such as Steinberg or Engelmaier is a plus.

- FEA

📌 Avionics Mechanical Design (Quinte West)
🏢 Blue Origin
📍 Quinte West