Elevate your career as a Principal Advanced Optical Packaging Engineer at Ranovus in Ottawa, Ontario. Focus on cutting-edge optical technologies for AI and data-center connectivity in this full-time role. In this pivotal position, you'll leverage your 10+ years of experience in advanced optical packaging and photonic assembly. You'll drive processes from development through to manufacturing transfer, working collaboratively with design teams, suppliers, and manufacturing partners. This hands-on role demands expertise in flip-chip and BGA assembly, fiber attachment, and thermal management.

Key Responsibilities
• Develop packaging and assembly strategies based on product requirements
• Lead flip-chip bonding and fine-pitch die attachment processes




• Oversee hybrid integration of lasers and optical components
• Manage fiber-array attach processes and inspection methods
• Define tooling and SOPs for production ramp-up

Requirements:
• 10+ years in advanced optical or semiconductor packaging
• Hands-on flip-chip and optical alignment experience
• Strong knowledge of materials and manufacturing processes
• Proven ability to manage external partners
• Excellent communication and technical judgment Bring your creative mindset and technical expertise to Ranovus and drive the future of optical packaging technology.

📌 Principal Optical Packaging Engineer in Ottawa
🏢 RANOVUS
📍 Ottawa