Elevate your career as a Principal Advanced Optical Packaging Engineer at Ranovus in Ottawa, Ontario. Focus on cutting-edge optical technologies for AI and data-center connectivity in this full time role. In this pivotal position, you'll leverage your 10+ years of experience in advanced optical packaging and photonic assembly. You'll drive processes from development through to manufacturing transfer, working collaboratively with design teams, suppliers, and manufacturing partners. This hands-on role demands expertise in flip-chip and BGA assembly, fiber attachment, and thermal management. Key Responsibilities:

- Develop packaging and assembly strategies based on product requirements
- Lead flip-chip bonding and fine-pitch die attachment processes




- Oversee hybrid integration of lasers and optical components
- Manage fiber-array attach processes and inspection methods
- Define tooling and SOPs for production ramp-up

Requirements:

- 10+ years in advanced optical or semiconductor packaging
- Hands-on flip-chip and optical alignment experience
- Strong knowledge of materials and manufacturing processes
- Proven ability to manage external partners
- Excellent communication and technical judgment

Bring your innovative mindset and technical expertise to Ranovus and drive the future of optical packaging technology. #J-18808-Ljbffr

📌 Principal Optical Packaging Engineer in Ottawa (Canada)
🏢 RANOVUS
📍 Canada