Elevate your career with Synopsys as a Senior Package Design Engineer, where your decade-long experience shapes advanced IP test chip architectures. Drive signal integrity and power integrity for cutting-edge semiconductor solutions.You will lead the design of multiple test-chip packages, collaborating across teams and with external partners. Your expertise in package architecture evaluation and hands-on design using Ansys HFSS will be vital for optimizing performance.
This role calls for a deep understanding of electrical modeling and effective communication with stakeholders throughout the project lifecycle.Key Responsibilities:- Lead package designs from requirements to final delivery- Define and optimize bump maps and layer stack-ups- Perform hands-on design of advanced package substrates- Analyze electrical models against SI and PI requirements- Provide expert guidance through architectural evaluationsRequirements:- 10+ years in semiconductor package design- Advanced knowledge of circuit theory and transmission line behavior- Experience with Ansys HFSS or similar tools- Solid communication skills in English- Bachelor's in electrical engineering or equivalentBring your skills in package architecture and design to provide exceptional value to Synopsys customers.#J-18808-Ljbffr