Elevate your career as a Principal Advanced Optical Packaging Engineer at Ranovus in Ottawa, Ontario. Focus on cutting-edge optical technologies for AI and data-center connectivity in this full-time role.
In this pivotal position, you'll leverage your 10+ years of experience in advanced optical packaging and photonic assembly. You'll drive processes from development through to manufacturing transfer, working collaboratively with design teams, suppliers, and manufacturing partners. This hands-on role demands expertise in flip-chip and BGA assembly, fiber attachment, and thermal management.
Key Responsibilities:



- Develop packaging and assembly strategies based on product requirements - Lead flip-chip bonding and fine-pitch die attachment processes - Oversee hybrid integration of lasers and optical components - Manage fiber-array attach processes and inspection methods - Define tooling and SOPs for production ramp-up
Requirements: - 10+ years in advanced optical or semiconductor packaging - Hands-on flip-chip and optical alignment experience - Robust knowledge of materials and manufacturing processes - Proven ability to manage external partners - Excellent communication and technical judgment
Bring your innovative mindset and technical expertise to Ranovus and drive the future of optical packaging technology.#J-18808-Ljbffr

📌 Principal Optical Packaging Engineer In Ottawa (Riviere-des-Prairies—Pointe-aux-Trembles)
🏢 RANOVUS
📍 Riviere-des-Prairies—Pointe-aux-Trembles