Elevate your career as a Principal Advanced Optical Packaging Engineer at Ranovus in Ottawa, Ontario. Focus on cutting-edge optical technologies for AI and data-center connectivity in this full time role.

In this pivotal position, you'll leverage your 10+ years of experience in advanced optical packaging and photonic assembly. You'll drive processes from development through to manufacturing transfer, working collaboratively with design teams, suppliers, and manufacturing partners. This hands-on role demands expertise in flip-chip and BGA assembly, fiber attachment, and thermal management.

Key Responsibilities:



• Develop packaging and assembly strategies based on product requirements • Lead flip-chip bonding and fine-pitch die attachment processes • Oversee hybrid integration of lasers and optical components • Manage fiber-array attach processes and inspection methods • Define tooling and SOPs for production ramp-up

Requirements: • 10+ years in advanced optical or semiconductor packaging • Hands-on flip-chip and optical alignment experience • Strong knowledge of materials and manufacturing processes • Proven ability to manage external partners • Excellent communication and technical judgment

Bring your innovative mindset and technical expertise to Ranovus and drive the future of optical packaging technology.

📌 Principal Optical Packaging Engineer in Ottawa (Ahuntsic)
🏢 RANOVUS
📍 Ahuntsic