Senior Optical Packaging & Flip-Chip Process Architect - $145,000 - $165,000 A Year (Ottawa)

Senior Optical Packaging & Flip-Chip Process Architect - $145,000 - $165,000 A Year (Ottawa)

16 Oct
|
Sanmina-SCI Systems de México
|
Ottawa

16 Oct

Sanmina-SCI Systems de México

Ottawa

Lead process architecture and development for optical and microelectronic solutions. Define assembly strategies, develop recipes, and mentor engineers.

📌 Senior Optical Packaging & Flip-Chip Process Architect - $145,000 - $165,000 A Year (Ottawa)
🏢 Sanmina-SCI Systems de México
📍 Ottawa

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