Embark on a transformative internship as a Digital Design Engineering Intern with Qualcomm in Toronto, Canada. Join a pioneering tech company and leverage your skills in hardware design to influence tomorrow's technology.
Qualcomm is seeking motivated Digital Design Engineering Interns for a 16-month program, beginning May/June 2027. This role focuses on high-speed interconnect solutions and requires skills in digital design, hardware languages, and analytical problem solving. Interns will gain hands-on experience and mentorship, working closely with a dynamic team to deliver real-world impact.
Key Responsibilities:
• Learn fundamentals of High-Speed Interconnect and SerDes Design
• Own the design implementation of current features
• Assess specifications and devise implementation plans




• Analyze design bugs through test failures
• Collaborate cross-functionally with various engineering teams
Requirements:
• Enrolled in Electrical/Computer Engineering or related field
• Knowledge of Verilog/System Verilog and Python
• Experience in digital logic and design methodologies
• Expected graduation date of November 2028 or later
• 1+ years of programming experience in C, C++, or Python
Contribute to innovative projects and enhance your engineering skills at Qualcomm, shaping the future of technology.
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📌 Digital Design Engineering Intern at Qualcomm (Toronto)
🏢 QUALCOMM
📍 Toronto