Elevate your career with Synopsys as a Senior Package Design Engineer, where your decade-long experience shapes advanced IP test chip architectures. Drive signal integrity and power integrity for cutting-edge semiconductor solutions.
You will lead the design of multiple test-chip packages, collaborating across teams and with external partners. Your expertise in package architecture evaluation and hands-on design using Ansys HFSS will be vital for optimizing performance. This role calls for a deep understanding of electrical modeling and effective communication with stakeholders throughout the project lifecycle.
Key Responsibilities:



- Lead package designs from requirements to final delivery - Define and optimize bump maps and layer stack-ups - Perform hands-on design of advanced package substrates - Analyze electrical models against SI and PI requirements - Provide expert guidance through architectural evaluations
Requirements: - 10+ years in semiconductor package design - Advanced knowledge of circuit theory and transmission line behavior - Experience with Ansys HFSS or similar tools - Robust communication skills in English - Bachelor's in electrical engineering or equivalent
Bring your skills in package architecture and design to provide exceptional value to Synopsys customers.#J-18808-Ljbffr

📌 Senior Package Design Engineer At Synopsys Riviere Des Prairies—pointe Aux Trembles (Riviere-des-Prairies—Pointe-aux-Trembles)
🏢 Synopsys
📍 Riviere-des-Prairies—Pointe-aux-Trembles