Elevate your career with Synopsys as a Senior Package Design Engineer, where your decade-long experience shapes advanced IP test chip architectures. Drive signal integrity and power integrity for cutting-edge semiconductor solutions. You will lead the design of multiple test-chip packages, collaborating across teams and with external partners. Your expertise in package architecture evaluation and hands-on design using Ansys HFSS will be vital for optimizing performance. This role calls for a deep understanding of electrical modeling and effective communication with stakeholders throughout the project lifecycle. Key Responsibilities:

- Lead package designs from requirements to final delivery
- Define and optimize bump maps and layer stack-ups




- Perform hands-on design of advanced package substrates
- Analyze electrical models against SI and PI requirements
- Provide expert guidance through architectural evaluations

Requirements:

- 10+ years in semiconductor package design
- Advanced knowledge of circuit theory and transmission line behavior
- Experience with Ansys HFSS or similar tools
- Robust communication skills in English
- Bachelor's in electrical engineering or equivalent

Bring your skills in package architecture and design to provide exceptional value to Synopsys customers. #J-18808-Ljbffr

📌 Senior Package Design Engineer at Synopsys (Ottawa)
🏢 Synopsys
📍 Ottawa