Elevate your career with Synopsys as a Senior Package Design Engineer, where your decade-long experience shapes advanced IP test chip architectures. Drive signal integrity and power integrity for cutting-edge semiconductor solutions.

You will lead the design of multiple test-chip packages, collaborating across teams and with external partners. Your expertise in package architecture evaluation and hands-on design using Ansys HFSS will be vital for optimizing performance. This role calls for a deep understanding of electrical modeling and effective communication with stakeholders throughout the project lifecycle.

Key Responsibilities:
• Lead package designs from requirements to final delivery
• Define and optimize bump maps and layer stack-ups




• Perform hands-on design of advanced package substrates
• Analyze electrical models against SI and PI requirements
• Provide expert guidance through architectural evaluations

Requirements:
• 10+ years in semiconductor package design
• Advanced knowledge of circuit theory and transmission line behavior
• Experience with Ansys HFSS or similar tools
• Robust communication skills in English
• Bachelor's in electrical engineering or equivalent

Bring your skills in package architecture and design to provide exceptional value to Synopsys customers.
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📌 Senior Package Design Engineer at Synopsys (Quebec City)
🏢 Synopsys
📍 Quebec City