Elevate your career with Synopsys as a Senior Package Design Engineer, where your decade-long experience shapes advanced IP test chip architectures. Drive signal integrity and power integrity for cutting-edge semiconductor solutions.

You will lead the design of multiple test-chip packages, collaborating across teams and with external partners. Your expertise in package architecture evaluation and hands-on design using Ansys HFSS will be vital for optimizing performance. This role calls for a deep understanding of electrical modeling and effective communication with stakeholders throughout the project lifecycle.

Key Responsibilities:



• Lead package designs from requirements to final delivery • Define and optimize bump maps and layer stack-ups • Perform hands-on design of advanced package substrates • Analyze electrical models against SI and PI requirements • Provide expert guidance through architectural evaluations

Requirements: • 10+ years in semiconductor package design • Advanced knowledge of circuit theory and transmission line behavior • Experience with Ansys HFSS or similar tools • Robust communication skills in English • Bachelor's in electrical engineering or equivalent

Bring your skills in package architecture and design to provide exceptional value to Synopsys customers. #J-18808-Ljbffr

📌 Senior Package Design Engineer at Synopsys (Montreal)
🏢 Synopsys
📍 Montreal