Photonic Process Engineer: Wire Bonding & Die Attach - C$71,600 - C$114,400 A Year (Varennes)

Photonic Process Engineer: Wire Bonding & Die Attach - C$71,600 - C$114,400 A Year (Varennes)

06 Oct
|
A leading technology firm
|
Varennes

06 Oct

A leading technology firm

Varennes

Process Engineer needed to optimize assembly for Photonic Integrated Circuit products, involving wire bonding recipe design and reliability testing.

📌 Photonic Process Engineer: Wire Bonding & Die Attach - C$71,600 - C$114,400 A Year (Varennes)
🏢 A leading technology firm
📍 Varennes

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