Elevate semiconductor packaging projects with onsemi as a Modeling and Simulation Engineer in Waterloo, Ontario. Utilize thermal-mechanical simulations to support cutting-edge power module developments. Join onsemi's Corporate R&D; team as a Semiconductor Packaging Modeling and Simulation Engineer.

This critical role demands expertise in thermal-mechanical simulation, problem analysis, and the Ag/Cu sintering process. You will analyze reliability issues, develop cutting-edge methodology, and collaborate on thermal modeling for safety and efficiency. Key Responsibilities:

- Conduct thermal-mechanical simulations for microelectronic packaging
- Analyze reliability issues due to thermal problems




- Develop innovative simulation methodologies using AI and Digital Twin
- Maintain HW/SW environments for effective modeling
- Support team members on thermal modeling projects Requirements:
- Master’s or Ph.D. in Physics or Engineering
- 2-3+ years of experience in thermal and mechanical modeling
- Strong knowledge of CAD, Solidworks, and FEA software
- Familiarity with semiconductor packaging processes
- Excellent English communication skills Harness your expertise in modeling and simulation to empower onsemi's commitment to energy-efficient innovations.

📌 Modeling and Simulation Engineer at onsemi (Ontario)
🏢 Onsemi
📍 Ontario